Abstract: Trace Pb existing in widespread lead-free soldering manufacturing Currently, may impact on microstructure and property of lead free solder. Effect of trace Pb on microstructure and property of Sn-9Zn solder was investigated by means of XRD,SEM and electrochemical testing system etc. The results show that Zn-rich phase in Sn-9Zn solder significantly refine and Pb is solube in the solder at Pb content of 0.3%; microstructure remarkablely is refine at Pb content of 0.8%, and Pb precipitate in grain boundaries as well; wettability and microhardness of the solder increase with Pb content increasing, corrosion potential rise a little with Pb content increasing, however, corrosion current density decrease significantly with increasing Pb content. 

Key words: Metallic material, Sn alloy, Lead free solder, Pb, Sn-9Zn solder, Microstructure, Property

摘要： 微量铅在目前的无铅工艺生产制程中广泛存在，并可对无铅钎料组织性能产生重要影响。运用Ｘ射线衍射仪、扫描电镜及电化学测试系统等仪器设备，研究微量铅对Ｓｎ－９Ｚｎ钎料组织性能影响。结果表明：当Ｐｂ质量分数为０．３％时，Ｓｎ－９Ｚｎ钎料中富Ｚｎ相明显细化，Ｐｂ固溶于钎料中；当Ｐｂ质量分数为０．８％时，钎料组织得到细化，Ｐｂ还以单质形式存在晶界处；钎料润湿性随Ｐｂ含量增加而得到改善，钎料显微硬度随Ｐｂ含量增加而增加，钎料腐蚀电位随Ｐｂ含量增加略有增大，但腐蚀电流密度却随Ｐｂ含量增加而明显减小。

关键词: 金属材料 , 锡合金 , 无铅钎料铅 , Ｓｎ－９Ｚｎ钎料 , 组织 , 性能