Abstract: Effects of Pb on properties of Sn3.5Ag0.5Cu alloy solder were studied by Microhardness tester, TDA and so on. The result shows that Pb plays an important role in properties of Sn3.5Ag0.5Cu solder alloy. The melting temperature, wettablity and microhardness can be improved by adding element Pb to the Sn3.5Ag0.5Cu alloy solder. The melting temperature is decreased 8% by adding Pb. When the content of Pb in the solder is 0.5％, Sn3.5Ag0.5Cu alloy solder shows the highest microhardness, and it up to 21.5, and then rapidly decrease.

Key words: Pb , Sn3.5Ag0.5Cu solder , Properties

摘要： 利用显微硬度计、差热分析仪等仪器设备,研究了铅对Sn3.5Ag0.5Cu钎料合金性能的影响。实验结
果表明,铅对Sn3.5Ag0.5Cu钎料合金性能有较大的影响,添加铅后,Sn3.5Ag0.5Cu钎料合金熔化温度下降了8%;
钎料合金的润湿性得到改善;当w (Pb)达到0.5%时,Sn3.5Ag0.5Cu钎料合金显微硬度显微硬度值最大,达到21.5
HV之后快速下降。

关键词: 铅 , Sn3.5Ag0.5Cu钎料 , 性能