The Preparation and Curing Kinetics of the Silicon － Containing Epoxy Resin

Journal of Petrochemical Universities ›› 2009, Vol. 22 ›› Issue (2): 1-4.

1. Department of Material Science and Engineering, Beijing Institute of Petrochemical Technology, 

Beijing 102617,P.R. China;

2. College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029,P.R.China

Received:2008-03-10 Revised:2008-10-10 Published:2009-06-25 Online:2009-06-25

含硅环氧树脂的制备及其固化动力学研究

杨明山^1,2, 何杰², 刘铮¹

1.北京石油化工学院材料科学与工程系，北京102617;
2.北京化工大学材料科学与工程学院，北京100029

作者简介:杨明山(1963 -), 男, 北京市, 博士, 教授
基金资助:
国家电子信息发展基金资助项目(292 -2007);北京市自然科学基金资助项目(2072007);北京市教育委员会科技计划资助项目(KM200910017008)

Abstract

Abstract: Silicon－containing epoxy resin （CNE －Si） was synthesized from diphenylsiandiol （DPSD） and ortho－cresol novolac epoxy resin with SnCl_２ as catalyst．The chemical structure of CNE－Si prepared was characterized by FT－ IR，^１H －NMR ．The thermal stability was analyzed by TGA．The results show that the －Si－group enhanced the thermal stability of the epoxy resin．The curing kinetics of the system is studied by isothermal DSC．The kinetic parameters of the curing reaction including the activation energy and reaction order are calculated using Kissinger and Ozawa method，which offer basic date for the application of CNE－Si ．

Key words: Silicon － containing epoxy resin , Preparation , Curing kinetic

摘要： 采用二苯基硅二醇与邻甲酚醛环氧树脂在SnCl₂ 催化作用下合成了含硅环氧树脂(CNE - Si)，并用FT - IR、1 H - NMR对产物进行了结构表征，采用 TGA分析了含硅环氧树脂的热稳定性。结果表明，- Si -基团的引入大大提高了环氧树脂的热稳定性。采用非等温 DSC方法探讨了含硅环氧树脂的固化反应过程，用T -矱外推法确定了含硅环氧树脂在线性酚醛树脂固化剂作用下的固化工艺参数，即：起始固化温度为 110℃，最快的固化反应温度为125℃，后固化温度在170℃附近。用Kissinger和Ozawa法进行了动力学研究，得到了其固化反应活化能、反应级数等动力学参数，为含硅环氧树脂的应用提供了基础数据。

关键词: 含硅环氧树脂 , 制备 , 固化动力学

YANG Ming-shan, HE Jie, LIU Zheng. The Preparation and Curing Kinetics of the Silicon － Containing Epoxy Resin[J]. Journal of Petrochemical Universities, 2009, 22(2): 1-4.

杨明山,何杰,刘铮. 含硅环氧树脂的制备及其固化动力学研究[J]. 石油化工高等学校学报, 2009, 22(2): 1-4.

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