Journal of Liaoning Petrochemical University ›› 2006, Vol. 26 ›› Issue (1): 30-33.

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Orthogonal Test Research of the SiO2 Sol Stability

  

  1. School of Petrochemical Technology , Liaoning University of Petroleum & Chemical Technology ,
    Fushun Liaoning 113001, P .R .China
  • Received:2005-10-11 Published:2006-01-25 Online:2006-01-25

SiO2 溶胶稳定性的正交试验

王兴利, 邱国民, 张克铮   

  1. 辽宁石油化工大学石油化工学院, 辽宁抚顺113001
  • 作者简介:王兴利(1980 -), 男, 浙江临海市, 在读硕士。

Abstract:

  The silica sol is a kind of colloid solution, silica drop dispersing in water or solvents.Silica sol was prepared by sol-gel method from tetraethoxy silane (TEOS)with the ethanol as solvent and dilute hydrochloric as catalyst .Orthogonal test was used to study the effects on silica sol stability such as the mole ratio of water and TEOS , the mole ratio of EtOH and TEOS, pH , the mole ratio of DMF and TEOS and the temperature .The effects of the above factors can be used to control the silica sol stability .The results show that the mole ratio of EtOH and TEOS exhibits significant effect on the silica sol stability , the silica sol stability increases with the increasing mole ratio of EtOH and TEOS .The next is the mole ratio of DMF and TEOS .DFM makes gelation time become long .The other effects are least .The effect of temperature is the least, sol stability decreases with the increasing temperature .

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Key words:  Silica sol ,  Tetraethyl silicate ,  Orthogo nal test

摘要:       二氧化硅溶胶是二氧化硅微粒分散于水中或有机溶剂中的胶体溶液。以正硅酸乙酯(TEOS)为原料, 乙醇为溶剂, 盐酸为催化剂, 用溶胶-凝胶工艺制备二氧化硅溶胶, 用正交试验方法研究了水与正硅酸乙酯的摩尔比、溶剂乙醇(EtOH)与正硅酸乙酯的摩尔比、pH 、添加剂(DMF)与正硅酸乙酯的摩尔比和温度对二氧化硅溶胶稳定性的影响, 从而利用这些因素来实现对二氧硅溶胶稳定性的控制。结果表明, 乙醇与正硅酸乙酯的摩尔比对溶胶稳定性的影响最大, 随着乙醇与正硅酸乙酯的摩尔比的增加, 溶胶的稳定性增加。其次是添加剂与正硅酸乙酯的摩尔比, 加入添加剂DMF , 能使溶胶的凝胶时间延长。其他因素对溶胶稳定性的影响不大, 温度对溶胶稳定性的影响最小, 随着温度的上升, 溶胶的稳定性下降。

关键词: 硅溶胶,  正硅酸乙酯,  正交试验

Cite this article

WANG Xing -li,QIU Guo -min,ZHANG Ke -zheng. Orthogonal Test Research of the SiO2 Sol Stability[J]. Journal of Liaoning Petrochemical University, 2006, 26(1): 30-33.

王兴利, 邱国民, 张克铮. SiO2 溶胶稳定性的正交试验[J]. 辽宁石油化工大学学报, 2006, 26(1): 30-33.

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